Hangyu Kim
According to our database1,
Hangyu Kim
authored at least 2 papers
between 2006 and 2012.
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Bibliography
2012
Proceedings of the Computer Applications for Database, Education, and Ubiquitous Computing, 2012
2006
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process.
Microelectron. Reliab., 2006