Hanguang Zheng

According to our database, Hanguang Zheng authored at least 2 papers between 2015 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection.

David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu

Microelectron. Reliab., 2016

2015

Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules.

Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu

Microelectron. Reliab., 2015