Hang Hu
Affiliations:- Fudan University, Department of Microelectronics, State Key Laboratory of ASIC and System, Shanghai, China
According to our database1,
Hang Hu
authored at least 9 papers
between 2017 and 2018.
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Bibliography
2018
IEEE Trans. Circuits Syst. II Express Briefs, 2018
A Third-order Band-pass Fully-passive Noise-Shaping Modulator Based on a Time-interleaved SAR ADC.
Proceedings of the IEEE 61st International Midwest Symposium on Circuits and Systems, 2018
Proceedings of the IEEE 61st International Midwest Symposium on Circuits and Systems, 2018
2017
High speed digital ELD compensation with hybrid thermometer coding in CT ΔΣ modulators.
Proceedings of the IEEE 60th International Midwest Symposium on Circuits and Systems, 2017
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017
Proceedings of the 12th IEEE International Conference on ASIC, 2017