Hajdin Ceric

According to our database, Hajdin Ceric authored at least 13 papers between 2002 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Impact of via geometry and line extension on via-electromigration in nano-interconnects.

A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics.

Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr

Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

2015

Comparison of analytic distribution function models for hot-carrier degradation modeling in nLDMOSFETs.

Prateek Sharma, Stanislav Tyaginov, Yannick Wimmer, Florian Rudolf, Karl Rupp, Hubert Enichlmair, J. H. Park, Hajdin Ceric, Tibor Grasser

Microelectron. Reliab., 2015

2014

Electromigration reliability of open TSV structures.

Wolfhard H. Zisser, Hajdin Ceric, Josef Weinbub, Siegfried Selberherr

Microelectron. Reliab., 2014

2013

Stress evolution in the metal layers of TSVs with Bosch scallops.

Anderson Pires Singulani, Hajdin Ceric, Siegfried Selberherr

Microelectron. Reliab., 2013

2012

Electromigration failure in a copper dual-damascene structure with a through silicon via.

Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr

Microelectron. Reliab., 2012

Interconnect reliability dependence on fast diffusivity paths.

Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr

Microelectron. Reliab., 2012

2011

An analytical approach for physical modeling of hot-carrier induced degradation.

Stanislav Tyaginov, Ivan A. Starkov, Hubert Enichlmair, C. Jungemann, Jong Mun Park, Ehrenfried Seebacher, R. L. de Orio, Hajdin Ceric, Tibor Grasser

Microelectron. Reliab., 2011

A compact model for early electromigration failures of copper dual-damascene interconnects.

R. L. de Orio, Hajdin Ceric, Siegfried Selberherr

Microelectron. Reliab., 2011

A simulator for local anodic oxidation of silicon surfaces.

Lado Filipovic, Hajdin Ceric, Johann Cervenka, Siegfried Selberherr

Proceedings of the 24th Canadian Conference on Electrical and Computer Engineering, 2011

2010

Interface traps density-of-states as a vital component for hot-carrier degradation modeling.

Stanislav Tyaginov, Ivan A. Starkov, Oliver Triebl, Johann Cervenka, C. Jungemann, Sara Carniello, Jong Mun Park, Hubert Enichlmair, Markus Karner, Ch. Kernstock, Ehrenfried Seebacher, Rainer Minixhofer, Hajdin Ceric, Tibor Grasser

Microelectron. Reliab., 2010

Physically based models of electromigration: From Black's equation to modern TCAD models.

R. L. de Orio, Hajdin Ceric, Siegfried Selberherr

Microelectron. Reliab., 2010

2002

Simulative prediction of the resistance change due to electromigration induced void evolution.

Hajdin Ceric, Siegfried Selberherr

Microelectron. Reliab., 2002