Hailong Liao

According to our database, Hailong Liao authored at least 2 papers in 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

The Mathematical Model and Novel Final Test System for Wafer-Level Packaging.

Junhui Li, Wenya Tian, Hailong Liao, Can Zhou, Xiaohe Liu, Wenhui Zhu

IEEE Trans. Ind. Informatics, 2017

An Electromechanical Model and Simulation for Test Process of the Wafer Probe.

Junhui Li, Hailong Liao, Dasong Ge, Can Zhou, Chengdi Xiao, Qing Tian, Wenhui Zhu

IEEE Trans. Ind. Electron., 2017