Haeyong Park
According to our database1,
Haeyong Park
authored at least 4 papers
between 2014 and 2022.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2022
A 64Mpixel CMOS Image Sensor with 0.50µm Unit Pixels Separated by Front Deep-Trench Isolation.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
2020
5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2014
7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014