Haeng-Soo Lee

According to our database1, Haeng-Soo Lee authored at least 1 paper in 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2011
Numerical analysis of bonding process-induced deformation for 3D package.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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