H. P. Chan

According to our database, H. P. Chan authored at least 6 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2024

Cascaded Optical Fiber Sensor for Simultaneous Measurement of Ultraviolet Irradiance and Temperature.

Ru-Lei Xia, Juan Liu, Bin Liu, Xingdao He, Hau-Ping Chan, Jinhui Yuan, Xicong Li, Zabih Ghassemlooy, Qiao Gao, Yingying Hu, Qiang Wu

Proceedings of the 14th International Symposium on Communication Systems, 2024

2020

Sensing Characteristics of Fiber Fabry-Perot Sensors Based on Polymer Materials.

Zheng-Da Liu, Bin Liu, Juan Liu, Yanjun Fu, Mengyu Wang, Sheng-Peng Wan, Xingdao He, Jinhui Yuan, Hau-Ping Chan, Qiang Wu

IEEE Access, 2020

2008

Silicon oxynitride integrated waveguide for on-chip optical interconnects applications.

C. K. Wong, Hei Wong, Mansun Chan, Y. T. Chow, H. P. Chan

Microelectron. Reliab., 2008

2006

Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride.

C. K. Wong, Hei Wong, Mansun Chan, Chi-Wah Kok, H. P. Chan

Microelectron. Reliab., 2006

2004

Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.

M. A. Uddin, M. O. Alam, Yan Cheong Chan, H. P. Chan

Microelectron. Reliab., 2004

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.

C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So

Microelectron. Reliab., 2004