H. Murray
Timeline
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Bibliography
2008
Determination of temperature change inside IC packages during laser ablation of molding compound.
Microelectron. Reliab., 2008
Fast and rigorous use of thermal time constant to characterize back end of the line test structure in advanced technology.
Microelectron. Reliab., 2008
Dynamic study of the thermal laser stimulation response on advanced technology structures.
Microelectron. Reliab., 2008