H. J. Lu
According to our database1,
H. J. Lu
authored at least 3 papers
between 2004 and 2008.
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Bibliography
2008
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.
Microelectron. Reliab., 2008
2004