H. Bana
Timeline
2024
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Bibliography
2024
Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
DRAM-Peri FinFET - A Thermally-Stable High-Performance Advanced CMOS RMG Platform with Mo-Based pWFM for sub-10nm DRAM.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024