Gweltaz Gaudin
According to our database1,
Gweltaz Gaudin
authored at least 5 papers
between 2010 and 2015.
Collaborative distances:
Collaborative distances:
Timeline
2010
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2012
2013
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2015
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2015
Proceedings of the 2015 International Conference on IC Design & Technology, 2015
2013
Novel low temperature 3D wafer stacking technology for high density device integration.
Proceedings of the European Solid-State Device Research Conference, 2013
2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.
Proceedings of the IEEE International Conference on 3D System Integration, 2010