Guy Lefranc

According to our database, Guy Lefranc authored at least 5 papers between 2001 and 2003.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of six.

2003

Aluminum bond-wire properties after 1 billion mechanical cycles.

Guy Lefranc, Brigitte Weiss, Christof Klos, J. Dick, Golta Khatibi, H. Berg

Microelectron. Reliab., 2003

High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC.

Gerard Coquery, Guy Lefranc, T. Licht, Richard Lallemand, Norbert Seliger, H. Berg

Microelectron. Reliab., 2003

2002

Reliable power electronics for automotive applications.

Norbert Seliger, E. Wolfgang, Guy Lefranc, H. Berg, T. Licht

Microelectron. Reliab., 2002

Properties of solders and their fatigue in power modules.

Guy Lefranc, T. Licht, Gerhard Mitic

Microelectron. Reliab., 2002

2001

Thermal management and reliability of multi-chip power modules.

Guy Lefranc, Gerhard Mitic, H.-J. Schultz

Microelectron. Reliab., 2001