Guoqing Cai

Orcid: 0000-0002-0214-8549

According to our database1, Guoqing Cai authored at least 12 papers between 2017 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2024
Manifold Learning-Based Common Spatial Pattern for EEG Signal Classification.
IEEE J. Biomed. Health Informatics, April, 2024

Topology-Regularized Self-Knowledge Distillation for Transductive-Inductive Learning of Brain Disorder Diagnosis.
Proceedings of the IEEE International Conference on Acoustics, 2024

CALSeg: Improving Calibration of Medical Image Segmentation Via Variational Label Smoothing.
Proceedings of the IEEE International Conference on Acoustics, 2024

2023
Quantum dynamics of two photons in the coherent feedback system composing of two separated resonators coupling to a waveguide.
J. Frankl. Inst., September, 2023

Quantum feedback control of a two-atom network closed by a semi-infinite waveguide.
CoRR, 2023

Tensor-based Complex-valued Graph Neural Network for Dynamic Coupling Multimodal brain Networks.
Proceedings of the IEEE International Conference on Acoustics, 2023

2021
A Three-Dimensional Boundary-Dependent Compact Thermal Network Model for IGBT Modules in New Energy Vehicles.
IEEE Trans. Ind. Electron., 2021

Amplitude-Phase Information Measurement on Riemannian Manifold for Motor Imagery-Based BCI.
IEEE Signal Process. Lett., 2021

DW-FBCSP: EEG emotion recognition algorithm based on scale distance weighted optimization.
Proceedings of the 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2021

2018
A Multi-Level Privacy-Preserving Approach to Hierarchical Data Based on Fuzzy Set Theory.
Symmetry, 2018

2017
Transmission Rate Analysis in Multi-Level Hierarchical Coded Caching.
Proceedings of the 86th IEEE Vehicular Technology Conference, 2017

Software-defined automation and control a preliminary study.
Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017


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