Guo-Quan Lu

According to our database, Guo-Quan Lu authored at least 15 papers between 2001 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Double-Sided Cooling Half-Bridge Power Module of 650V/150A Gallium Nitride High-Electron-Mobility Transistor.

Shengchang Lu, Bo Li, Emmanuel Arriola, Zichen Zhang, Carl Nicholas, Khai D. T. Ngo, Guo-Quan Lu

IEEE Trans. Ind. Electron., December, 2024

2023

Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors.

Shengchang Lu, Tianyu Zhao, Zichen Zhang, Khai D. T. Ngo, Rolando Burgos, Guo-Quan Lu

IEEE Trans. Ind. Electron., 2023

2021

Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement.

Shan Gao, Khai D. T. Ngo, Guo-Quan Lu

IEEE Trans. Ind. Electron., 2021

2017

Over-Molded Inductor (OMI) - Feasibility Demonstration in a DC-DC Converter.

Ting Ge, Yi Yan, Guo-Quan Lu, Khai D. T. Ngo

IEEE Trans. Ind. Electron., 2017

2016

Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection.

David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu

Microelectron. Reliab., 2016

2015

Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules.

Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu

Microelectron. Reliab., 2015

Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate.

Su-Yan Zhao, Xin Li, Yun-Hui Mei, Guo-Quan Lu

Microelectron. Reliab., 2015

Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions.

Haidong Yan, Yun-Hui Mei, Xin Li, Pu Zhang, Guo-Quan Lu

Microelectron. Reliab., 2015

2013

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force.

Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei

Microelectron. Reliab., 2013

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging.

Gang Chen, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li, Guo-Quan Lu, Xu Chen

Microelectron. Reliab., 2013

2005

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.

Y. C. Lin, Xu Chen, Xingsheng Liu, Guo-Quan Lu

Microelectron. Reliab., 2005

2002

Effect of substrate flexibility on solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2002

2001

Stacked solder bumping technology for improved solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2001

Design issues of a three-dimensional packaging scheme for power modules.

Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu

Microelectron. Reliab., 2001

Effects of device passivation materials on solderable metallization of IGBTs.

Shatil Haque, Guo-Quan Lu

Microelectron. Reliab., 2001