Guisheng Zou

According to our database, Guisheng Zou authored at least 2 papers between 2016 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application.

Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu

Microelectron. Reliab., 2018

2016

Effect of nano-Al₂O₃ reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints.

Zhenyu Zhao, Lei Liu, Hyun Seok Choi, Jian Cai, Qian Wang, Yuming Wang, Guisheng Zou

Microelectron. Reliab., 2016