Guanglan Liao

According to our database, Guanglan Liao authored at least 26 papers between 2005 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

A Novel Chip-on-Board Defect Detection Approach Combining Infrared Thermal Evolution and Self-Supervised Transformer.

Ye Jiang, Zhiyong Liu, Guanglan Liao, Bo Ma

IEEE Trans. Ind. Informatics, May, 2024

2022

MS-SSPCANet: A powerful deep learning framework for tool wear prediction.

Jian Duan, Cheng Hu, Xiaobin Zhan, Hongdi Zhou, Guanglan Liao, Tielin Shi

Robotics Comput. Integr. Manuf., 2022

2018

Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.

Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi

IEEE Trans. Ind. Informatics, 2018

Microscopic Three-Dimensional Measurement Based on Telecentric Stereo and Speckle Projection Methods.

Kepeng Chen, Tielin Shi, Qiang Liu, Zirong Tang, Guanglan Liao

Sensors, 2018

Using GA-SVM for defect inspection of flip chips based on vibration signals.

Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su

Microelectron. Reliab., 2018

2017

Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings.

Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai

Sensors, 2017

Using Wavelet Packet Transform for Surface Roughness Evaluation and Texture Extraction.

Xiao Wang, Tielin Shi, Guanglan Liao, Yichun Zhang, Yuan Hong, Kepeng Chen

Sensors, 2017

2016

Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging.

Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao

Sensors, 2016

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm.

Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao

Microelectron. Reliab., 2016

Machine fault classification using deep belief network.

Zhuyun Chen, Xueqiong Zeng, Weihua Li, Guanglan Liao

Proceedings of the IEEE International Instrumentation and Measurement Technology Conference, 2016

2015

Genetic algorithms for defect detection of flip chips.

Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao

Microelectron. Reliab., 2015

Using RBF networks for detection and prediction of flip chip with missing bumps.

Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi

Microelectron. Reliab., 2015

Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.

Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi

Microelectron. Reliab., 2015

2014

Using active thermography for defects inspection of flip chip.

Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao

Microelectron. Reliab., 2014

2013

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.

Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao

Sensors, 2013

Image registration using a point-line duality based line matching method.

Ke Wang, Tielin Shi, Guanglan Liao, Qi Xia

J. Vis. Commun. Image Represent., 2013

2012

Defect detection of flip-chip solder joints using modal analysis.

Junchao Liu, Tielin Shi, Ke Wang, Zirong Tang, Guanglan Liao

Microelectron. Reliab., 2012

Finite element analysis on the micro-forming process of Zr-based bulk metallic glass.

Qiang Yu, Jun Wang, Weijie Zhang, Guanglan Liao

Proceedings of the IEEE 16th International Conference on Computer Supported Cooperative Work in Design, 2012

2011

A pattern matching method using geometric information of images.

Ke Wang, Qi Xia, Tielin Shi, Guanglan Liao, Shiyuan Liu

Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

2009

Scratch of submicron grooves on aluminum film with AFM diamond tip.

Ping Peng, Tielin Shi, Guanglan Liao, Zirong Tang, Chang Liu

Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

Low temperature direct bonding for hermetic wafer level packaging.

Lei Nie, Tielin Shi, Zirong Tang, Shiyuan Liu, Guanglan Liao

Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

Improved adhesion between C-MEMS and substrate by micromechanical interlocking.

Jie Gong, Zirong Tang, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu

Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

2006

Pattern Discovery from Time Series Using Growing Hierarchical Self-Organizing Map.

Shiyuan Liu, Li Lu, Guanglan Liao, Jianping Xuan

Proceedings of the Neural Information Processing, 13th International Conference, 2006

2005

Feature Selection and Classification of Gear Faults Using SOM.

Guanglan Liao, Tielin Shi, Weihua Li, Tao Huang

Proceedings of the Advances in Neural Networks - ISNN 2005, Second International Symposium on Neural Networks, Chongqing, China, May 30, 2005

Feature selection and condition monitoring of gearbox using SOM.

Guanglan Liao, Tielin Shi, Jianping Xuan

Proceedings of the IEEE International Joint Conference on Neural Networks, 2005

A Novel Technique for Data Visualization Based on SOM.

Guanglan Liao, Tielin Shi, Shiyuan Liu, Jianping Xuan

Proceedings of the Artificial Neural Networks: Biological Inspirations, 2005