Greet Verbinnen

According to our database, Greet Verbinnen authored at least 3 papers between 2009 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design.

Alexandru Andrei, Nina Tutunjyan, Greet Verbinnen, Steven VanPut, Olga Krylychkina, Wolfgang Eberle, Silke Musa

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

TSV metrology and inspection challenges.

Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, Irfan Malik

Proceedings of the IEEE International Conference on 3D System Integration, 2009