Golta Khatibi

According to our database, Golta Khatibi authored at least 21 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Characterization of cyclic delamination behavior of thin film multilayers.

Thomas Walter, Golta Khatibi, Michael Nelhiebel, M. Stefenelli

Microelectron. Reliab., 2018

Effect of aging on mechanical properties of high temperature Pb-rich solder joints.

Golta Khatibi, A. Betzwar Kotas, Martin Lederer

Microelectron. Reliab., 2018

Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl.

Bernhard Czerny, Golta Khatibi

Microelectron. Reliab., 2018

2017

Wire bond degradation under thermo- and pure mechanical loading.

Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2017

Reliability of Cu wire bonds in microelectronic packages.

Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss

Microelectron. Reliab., 2017

High cycle fatigue testing of thermosonic ball bonds.

Alice Lassnig, Martin Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel

Microelectron. Reliab., 2017

Isothermal bending fatigue response of solder joints in high power semiconductor test structures.

A. Betzwar Kotas, Golta Khatibi

Microelectron. Reliab., 2017

2016

Delamination of polyimide/Cu films under mixed mode loading.

Thomas Walter, Martin Lederer, Golta Khatibi

Microelectron. Reliab., 2016

Fatigue testing method for fine bond wires in an LQFP package.

Bernhard Czerny, Ali Mazloum-Nejadari, Golta Khatibi, Laurens Weiss, Michael Zehetbauer

Microelectron. Reliab., 2016

Interface reliability and lifetime prediction of heavy aluminum wire bonds.

Bernhard Czerny, Golta Khatibi

Microelectron. Reliab., 2016

2015

Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges.

Ephraim Suhir, A. Bensoussan, Golta Khatibi, Johann Nicolics

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

A fast reliability assessment method for Si MEMS based microcantilever beams.

Peyman Rafiee, Golta Khatibi

Microelectron. Reliab., 2014

Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique.

Julien Magnien, Golta Khatibi

Microelectron. Reliab., 2014

2013

Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages.

Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer

Microelectron. Reliab., 2013

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects.

Bernhard Czerny, I. Paul, Golta Khatibi, Markus Thoben

Microelectron. Reliab., 2013

2012

High temperature storage reliability investigation of the Al-Cu wire bond interface.

Rainer Pelzer, Michael Nelhiebel, Robert Zink, Stefan Wöhlert, Alice Lassnig, Golta Khatibi

Microelectron. Reliab., 2012

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions.

Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben

Microelectron. Reliab., 2012

2010

A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects.

Bernhard Czerny, Golta Khatibi, Brigitte Weiss, T. Licht

Microelectron. Reliab., 2010

2009

A novel accelerated test technique for assessment of mechanical reliability of solder interconnects.

Golta Khatibi, W. Wroczewski, Brigitte Weiss, H. Ipser

Microelectron. Reliab., 2009

2008

A fast mechanical test technique for life time estimation of micro-joints.

Golta Khatibi, W. Wroczewski, Brigitte Weiss, T. Licht

Microelectron. Reliab., 2008

2003

Aluminum bond-wire properties after 1 billion mechanical cycles.

Guy Lefranc, Brigitte Weiss, Christof Klos, J. Dick, Golta Khatibi, H. Berg

Microelectron. Reliab., 2003