Giovanni Breglio

Orcid: 0000-0002-9350-5483

According to our database1, Giovanni Breglio authored at least 42 papers between 2004 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Online presence:

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Bibliography

2024
Real-Time Myocardial Infarction Detection Approaches with a Microcontroller-Based Edge-AI Device.
Sensors, February, 2024

Study and Validation of an Electrical Anti-Ice Integrated System for Carbon Fiber Leading Edge Airplane Wing Section.
IEEE Trans. Instrum. Meas., 2024

IoT Node Interrogation System for Fiber Bragg Grating Sensors: Design, Characterization, and On-Field Test.
IEEE Trans. Instrum. Meas., 2024

A Novel Method for Transverse Beam-Coupling Impedance Measurements in Particle Accelerator Devices Using the Bead-Pull Method.
IEEE Trans. Instrum. Meas., 2024

Plethysmography of peripheral artery using Fiber Bragg Grating sensors: preliminary results.
Proceedings of the IEEE International Workshop on Metrology for Industry 4.0 and IoT, 2024

An Electrothermal Anti-Ice System Embedded into a Leading Edge Profile Validated Through Fiber Optic Sensors.
Proceedings of the 2024 IEEE International Symposium on Measurements & Networking (M&N), 2024

2023
Innovative Photonic Sensors for Safety and Security, Part I: Fundamentals, Infrastructural and Ground Transportations.
Sensors, March, 2023

Innovative Photonic Sensors for Safety and Security, Part II: Aerospace and Submarine Applications.
Sensors, March, 2023

Innovative Photonic Sensors for Safety and Security, Part III: Environment, Agriculture and Soil Monitoring.
Sensors, March, 2023

Experimental Tests of a Full Analog Fiber Optic Monitoring System Suitable for Safety Application at CERN.
IEEE Trans. Instrum. Meas., 2023

Direct Measurement of Beam-Induced Heating on Accelerator Pipes With Fiber Optic Sensors: Numerical Analysis Validation.
IEEE Trans. Instrum. Meas., 2023

Fiber Bragg Grating Embedded in Soft Patch for Finger Tapping Assessment.
Proceedings of the 2023 IEEE International Workshop on Metrology for Industry 4.0 & IoT, 2023

Efficient Optimization of SFQ-Based Logic Circuits: Introducing a Novel Methodology for Performance and Design Enhancement.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2023

A Microcontroller-Based System for Human-Emotion Recognition with Edge-AI and Infrared Thermography.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2023

2022
Liquid Resin Infusion Process Validation through Fiber Optic Sensor Technology.
Sensors, 2022

Multimodal Finger Pulse Wave Sensing: Comparison of Forcecardiography and Photoplethysmography Sensors.
Sensors, 2022

Atrial Fibrillation Detection by Means of Edge Computing on Wearable Device: A Feasibility Assessment.
Proceedings of the IEEE International Symposium on Medical Measurements and Applications, 2022

2021
Multichannel Approach for Arrayed Waveguide Grating-Based FBG Interrogation Systems.
Sensors, 2021

Fiber optic monitoring system ready for 4-20mA industrial control standard.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2019
Development and optimization of an energy harvesting circuit for multiple piezoelectric elements integrated into a smart air spring.
Proceedings of the 5th IEEE International forum on Research and Technology for Society and Industry, 2019

Feel-tire Unina: Development and Modeling of a Sensing System for Intelligent Tires.
Proceedings of the 5th IEEE International forum on Research and Technology for Society and Industry, 2019

Wide Range AWG-Based FBG Interrogation System With Improved Sensitivity.
Proceedings of the 15th Conference on Ph.D. Research in Microelectronics and Electronics, 2019

Simulation of an Optical-to-Digital Converter for High Frequency FBG Interrogator.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2019

2017
Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2017

2016
On the avalanche ruggedness of optimized termination structure for 600 V punch-through IGBTs.
Microelectron. Reliab., 2016

200 V Fast Recovery Epitaxial Diode with superior ESD capability.
Microelectron. Reliab., 2016

2015
A robust electro-thermal IGBT SPICE model: Application to short-circuit protection circuit design.
Microelectron. Reliab., 2015

2014
Impact of gate drive voltage on avalanche robustness of trench IGBTs.
Microelectron. Reliab., 2014

Thermal-aware design and fault analysis of a DC/DC parallel resonant converter.
Microelectron. Reliab., 2014

2013
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations.
Microelectron. Reliab., 2013

Physically based analytical model of the blocking I-V curve of Trench IGBTs.
Microelectron. Reliab., 2013

2012
3D electro-thermal simulations of wide area power devices operating in avalanche condition.
Microelectron. Reliab., 2012

2011
Electro-thermal characterization of AlGaN/GaN HEMT on Silicon Microstrip Technology.
Microelectron. Reliab., 2011

2010
A novel UIS test system with Crowbar feedback for reduced failure energy in power devices testing.
Microelectron. Reliab., 2010

Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography.
Microelectron. Reliab., 2010

2009
1300 V, 2 ms pulse inductive load switching test circuit with 20 ns selectable crowbar intervention.
Microelectron. Reliab., 2009

2008
Detection of localized UIS failure on IGBTs with the aid of lock-in thermography.
Microelectron. Reliab., 2008

2007
New developments of THERMOS<sup>3</sup>, a tool for 3D electro-thermal simulation of smart power MOSFETs.
Microelectron. Reliab., 2007

Study of a failure mechanism during UIS switching of planar PT-IGBT with current sense cell.
Microelectron. Reliab., 2007

2006
Effect of a buffer layer in the epi-substrate region to boost the avalanche capability of a 100V Schottky diode.
Microelectron. Reliab., 2006

2005
Reliability enhancement with the aid of transient infrared thermal analysis of smart Power MOSFETs during short circuit operation.
Microelectron. Reliab., 2005

2004
Experimental characterization of temperature distribution on Power MOS devices during Unclamped Inductive Switching.
Microelectron. Reliab., 2004


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