Ghim Boon Ang

According to our database, Ghim Boon Ang authored at least 5 papers in 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Static fault localization of subtle metallization defects using near infrared photon emission microscopy.

Alfred C. T. Quah, Dayanand Nagalingam, Seung Je Moon, Edy Susanto, Ghim Boon Ang, Soh Ping Neo, Jeffrey Lam, Zhihong Mai

Microelectron. Reliab., 2017

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect.

Soh Ping Neo, Alfred C. T. Quah, Ghim Boon Ang, Dayanand Nagalingam, Hnin Hnin Ma, Siong Luong Ting, C. W. Soo, Changqing Chen, Zhihong Mai, Jeffrey Lam

Microelectron. Reliab., 2017

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis.

Changqing Chen, Ghim Boon Ang, Peng Tiong Ng, Francis Rivai, Hui Peng Ng, Alfred C. T. Quah, Angela Teo, Jeffery Lam, Zhihong Mai

Microelectron. Reliab., 2017

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern.

Changqing Chen, Ghim Boon Ang, Peng Tiong Ng, Francis Rivai, Soh Ping Neo, Dayanand Nagalingam, Kim Hong Yip, Jeffery Lam, Zhihong Mai

Microelectron. Reliab., 2017

In-depth circuits edit analysis to reveal the implantation-related defect.

Changqing Chen, Ghim Boon Ang, Jeffrey Lam, Zhihong Mai

Microelectron. J., 2017