Gerald Beyer
According to our database1,
Gerald Beyer
authored at least 17 papers
between 2011 and 2024.
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Bibliography
2024
Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration.
Proceedings of the International 3D Systems Integration Conference, 2024
2023
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.
Microelectron. Reliab., 2014
2012
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012
2011
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011