Gang Dong
Orcid: 0000-0001-6557-2286
According to our database1,
Gang Dong
authored at least 70 papers
between 1994 and 2024.
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Bibliography
2024
Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2024
A 3-D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias.
IEEE Trans. Circuits Syst. II Express Briefs, May, 2024
J. Real Time Image Process., May, 2024
Group-wise co-salient object detection via multi-view self-labeling novel class discovery.
Frontiers Comput. Sci., April, 2024
IEEE Signal Process. Lett., 2024
Proceedings of the IEEE International Conference on Acoustics, 2024
Segment Anything Model Guided Semantic Knowledge Learning For Remote Sensing Change Detection.
Proceedings of the IEEE International Conference on Acoustics, 2024
2023
Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method.
IEEE Trans. Very Large Scale Integr. Syst., November, 2023
Appl. Intell., June, 2023
Stacked arrangement of substrate integrated waveguide cavity-backed semicircle patches for wideband circular polarization with filtering effect.
Frontiers Inf. Technol. Electron. Eng., May, 2023
Knowl. Based Syst., March, 2023
IEEE Trans. Geosci. Remote. Sens., 2023
Robotics Comput. Integr. Manuf., 2023
J. Comput. Methods Sci. Eng., 2023
SGED: A Benchmark dataset for Performance Evaluation of Spiking Gesture Emotion Recognition.
CoRR, 2023
Neuromorphic Text Emotion Recognition: Harnessing Bio- Inspired Computing for Energy-Efficient and Robust Solution.
Proceedings of the IEEE International Conference on High Performance Computing & Communications, 2023
2022
3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration.
IEEE Trans. Very Large Scale Integr. Syst., 2022
Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
Estimating Carbon, Nitrogen, and Phosphorus Contents of West-East Grassland Transect in Inner Mongolia Based on Sentinel-2 and Meteorological Data.
Remote. Sens., 2022
J. Intell. Fuzzy Syst., 2022
Int. J. Comput. Math., 2022
Proceedings of the MultiMedia Modeling - 28th International Conference, 2022
Proceedings of the Neural Information Processing - 29th International Conference, 2022
Improving Autism Spectrum Disorder Prediction by Fusion of Multiple Measures of Resting-State Functional MRI Data.
Proceedings of the 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2022
Proceedings of the 2022 2nd International Conference on Algorithms, 2022
2021
Proceedings of the International Joint Conference on Neural Networks, 2021
2020
ACM Trans. Graph., 2020
Estimation of the Grassland Aboveground Biomass of the Inner Mongolia Plateau Using the Simulated Spectra of Sentinel-2 Images.
Remote. Sens., 2020
Proceedings of the IEEE/WIC/ACM International Joint Conference on Web Intelligence and Intelligent Agent Technology, 2020
2019
Thermal-Aware Modeling and Analysis for a Power Distribution Network Including Through-Silicon-Vias in 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019
Relative roles of the replacement and richness difference components of beta diversity following the ecological restoration of a mountain meadow, north China.
Ecol. Informatics, 2019
Proceedings of the 2019 IEEE Intl Conf on Parallel & Distributed Processing with Applications, 2019
2018
Comput. Electr. Eng., 2018
2017
Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs).
Microelectron. J., 2017
2016
Robotica, 2016
Antenna-in-package system integrated with meander line antenna based on LTCC technology.
Frontiers Inf. Technol. Electron. Eng., 2016
New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).
IEICE Electron. Express, 2016
Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential.
IEICE Electron. Express, 2016
Application of species, phylogenetic and functional diversity to the evaluation on the effects of ecological restoration on biodiversity.
Ecol. Informatics, 2016
Proceedings of the Advances on P2P, 2016
2015
A Doubly Degenerate Diffusion Model Based on the Gray Level Indicator for Multiplicative Noise Removal.
IEEE Trans. Image Process., 2015
Salt-and-Pepper Noise Removal via Local Hölder Seminorm and Nonlocal Operator for Natural and Texture Image.
J. Math. Imaging Vis., 2015
A Multi-Output on-Chip Switched-Capacitor DC-DC Converter with Unequal Flying Capacitors for Different Power Modes.
J. Circuits Syst. Comput., 2015
IEICE Electron. Express, 2015
Analysis and evaluation of coupling between adjacent TSVs with considering the discharging path.
IEICE Electron. Express, 2015
Proceedings of the Computer and Computing Technologies in Agriculture IX, 2015
Dynamic Modeling and Performance Analysis of a Redundantly Actuated 2-DOF Parallel Manipulator.
Proceedings of the Intelligent Robotics and Applications - 8th International Conference, 2015
2014
IEICE Electron. Express, 2014
2013
Two-dimensional electrical modeling of thermoelectric devices considering temperature-dependent parameters under the condition of nonuniform substrate temperature distribution.
Microelectron. J., 2013
2012
Dimensional Synthesis of a Planar Parallel Manipulator for Pick-and-Place Operations Based on Rigid-Body Dynamics.
Proceedings of the Intelligent Robotics and Applications - 5th International Conference, 2012
Proceedings of the Fifth International Conference on Business Intelligence and Financial Engineering, 2012
2011
An exact algorithm for vehicle routing and scheduling problem of free pickup and delivery service in flight ticket sales companies based on set-partitioning model.
J. Intell. Manuf., 2011
2010
Proceedings of the International Conference on Computational Science, 2010
2009
Proceedings of the Second International Joint Conference on Computational Sciences and Optimization, 2009
2008
Proceedings of the Advanced Concepts for Intelligent Vision Systems, 2008
2007
IEEE Signal Process. Lett., 2007
J. Electronic Imaging, 2007
2006
Quantitative cell motility for in vitro wound healing using level set-based active contour tracking.
Proceedings of the 2006 IEEE International Symposium on Biomedical Imaging: From Nano to Macro, 2006
Motion Flow Estimation from Image Sequences with Applications to Biological Growth and Motility.
Proceedings of the International Conference on Image Processing, 2006
Proceedings of the International Conference on Image Processing, 2006
2005
IEEE Trans. Medical Imaging, 2005
Analysis of the Effect of LUT Size on FPGA Area and Delay Using Theoretical Derivations.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
Tracking multiple cells by correspondence resolution in a sequential Bayesian framework.
Proceedings of the 2005 International Conference on Image Processing, 2005
2004
Proceedings of the 17th IEEE Symposium on Computer-Based Medical Systems (CBMS 2004), 2004
2003
Proceedings of the 2003 International Conference on Image Processing, 2003
1994
Proceedings of IAPR Workshop on Machine Vision Applications, 1994