G. Q. Zhang
Orcid: 0000-0002-1131-4510Affiliations:
- Delft University of Technology, Delft, The Netherlands
According to our database1,
G. Q. Zhang
authored at least 105 papers
between 2003 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Data-Driven Remote Center of Cyclic Motion (RC$^{2}$M) Control for Redundant Robots With Rod-Shaped End-Effector.
IEEE Trans. Ind. Informatics, April, 2024
<i>In</i>-<i>Situ</i> early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks.
Expert Syst. Appl., March, 2024
Proceedings of the IEEE International Test Conference, 2024
An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024
A 70-V Fully Integrated Dual-SSHC Rectifier for Triboelectric Energy Harvesting with Full-Digital Duty-Cycle-Based MPPT Achieving 598% Power Extraction Enhancement.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024
2023
Ball-Spin Control and Vibration Reduction Methods for Three-Wheel Pitching Device of Tennis Training Robot.
J. Intell. Robotic Syst., February, 2023
RNN-Based Quadratic Programming Scheme for Tennis-Training Robots With Flexible Capabilities.
IEEE Trans. Syst. Man Cybern. Syst., 2023
Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
2022
Analysis and Data-Based Modeling of the Photochemical Reaction Dynamics of the Induced Singlet Oxygen in Light Therapies.
IEEE Trans. Biomed. Eng., 2022
Analyzing Efficacy and Safety of Anti-Fungal Blue Light Therapy via Kernel-Based Modeling the Reactive Oxygen Species Induced by Light.
IEEE Trans. Biomed. Eng., 2022
Automatically recognize and segment morphological features of the 3D vertebra based on topological data analysis.
Comput. Biol. Medicine, 2022
Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects.
Proceedings of the IECON 2022, 2022
2021
Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021
Proceedings of the International Joint Conference on Neural Networks, 2021
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021
Proceedings of the Ninth International Conference on Advanced Cloud and Big Data, 2021
2020
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review.
Entropy, 2020
Proceedings of the 29th IEEE International Symposium on Industrial Electronics, 2020
2019
Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group.
CoRR, 2019
Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.
IEEE Access, 2019
IEEE Access, 2019
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method.
IEEE Access, 2019
Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019
2018
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.
Sensors, 2018
Reliab. Eng. Syst. Saf., 2018
A new hermetic sealing method for ceramic package using nanosilver sintering technology.
Microelectron. Reliab., 2018
A review on discoloration and high accelerated testing of optical materials in LED based-products.
Microelectron. Reliab., 2018
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging.
Microelectron. Reliab., 2018
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.
Microelectron. Reliab., 2018
2017
Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems.
IEEE Trans. Ind. Electron., 2017
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.
Reliab. Eng. Syst. Saf., 2017
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
Microelectron. Reliab., 2017
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method.
Microelectron. Reliab., 2017
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products.
Microelectron. Reliab., 2017
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.
IEEE Access, 2017
Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method.
IEEE Access, 2017
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017
High aspect ratio spiral resonators for process variation investigation and MEMS applications.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017
2016
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.
IEEE Trans. Ind. Electron., 2016
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.
Reliab. Eng. Syst. Saf., 2016
Effects of stress-loading test methods on the degradation of light-emitting diode modules.
Microelectron. Reliab., 2016
Applications of advanced controlmethods in spacecrafts: progress, challenges, and future prospects.
Frontiers Inf. Technol. Electron. Eng., 2016
2015
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.
Microelectron. Reliab., 2015
Microelectron. Reliab., 2015
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method.
Microelectron. Reliab., 2015
2014
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system.
Microelectron. Reliab., 2014
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes.
Microelectron. Reliab., 2014
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes.
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
Proceedings of the 44th European Solid State Device Research Conference, 2014
2013
Microelectron. Reliab., 2013
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013
2012
IEEE Trans. Signal Process., 2012
An approach to "Design for Reliability" in solid state lighting systems at high temperatures.
Microelectron. Reliab., 2012
Microelectron. Reliab., 2012
Proceedings of the AMIA 2012, 2012
2010
Sensors, 2010
2009
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.
Microelectron. Reliab., 2009
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics.
Microelectron. Reliab., 2009
Microelectron. Reliab., 2009
Microelectron. Reliab., 2009
2008
Microelectron. Reliab., 2008
Microelectron. Reliab., 2008
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
Microelectron. Reliab., 2008
2007
Molecular simulation on the material/interfacial strength of the low-dielectric materials.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectron. Reliab., 2007
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab., 2007
2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectron. Reliab., 2006
Microelectron. Reliab., 2006
Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem.
Eur. J. Oper. Res., 2006
2005
Microelectron. Reliab., 2005
2004
Microelectron. Reliab., 2004
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach.
Microelectron. Reliab., 2004
Microelectron. Reliab., 2004
Microelectron. Reliab., 2004
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.
Microelectron. Reliab., 2004
Microelectron. Reliab., 2004
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.
Microelectron. Reliab., 2004
2003
Microelectron. Reliab., 2003
Microelectron. Reliab., 2003