G. H. Bae

According to our database, G. H. Bae authored at least 2 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Thermo-Mechanical Reliability Characteristics of 8H HBM3.

Jinsoo Bae, H. G. Noh, S. J. Yoo, I. J. Choi, G. H. Bae, Y. M. Shim, S. G. Lee, H. Jang, S. M. Lee, G. H. Chang, K. S. Kwon, C. B. Yoon, S. Y. Lee, J. W. Pyun, H. J. Kim, S. B. Ko, Y. C. Hwang, S. Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs.

Sungmock Ha, S. Lee, G. H. Bae, D. S. Lee, S. H. Kim, B. W. Woo, N.-H. Lee, Y. S. Lee, S. Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2023