Fumito Imura

According to our database, Fumito Imura authored at least 4 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process.

Michihiro Inoue, Fumito Imura, Arami Saruwatari, Shiro Hara

Proceedings of the International Conference on IC Design and Technology, 2016

2015

Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.

Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi

Microelectron. J., 2015

2012

Cool System scalable 3-D stacked heterogeneous Multi-Core / Multi-Chip architecture for ultra low-power digital TV applications.

Yukoh Matsumoto, Tomoyuki Morimoto, Michiya Hagimoto, Hiroyuki Uchida, Nobuyuki Hikichi, Fumito Imura, Hiroshi Nakagawa, Masahiro Aoyagi

Proceedings of the 2012 IEEE Symposium on Low-Power and High-Speed Chips, 2012

2011

COOL interconnect low power interconnection technology for scalable 3D LSI design.

Marco Chacin, Hiroyuki Uchida, Michiya Hagimoto, Takashi Miyazaki, Takeshi Ohkawa, Rimon Ikeno, Yukoh Matsumoto, Fumito Imura, Motohiro Suzuki, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

Proceedings of the 2011 IEEE Symposium on Low-Power and High-Speed Chips, 2011