Fumihiro Inoue

According to our database, Fumihiro Inoue authored at least 25 papers between 1998 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Special Issue on Advanced Robotic Technology and System for DX in Construction Industry.

Takayuki Tanaka, Fumihiro Inoue, Hisashi Osumi, Hiroki Murakami

J. Robotics Mechatronics, 2024

Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding.

Mariappan Murugesan, Hiroyuki Hashimoto, Kentaro Mihara, Takashi Hare, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono

Proceedings of the International 3D Systems Integration Conference, 2024

Electrochemical Deposition of Indium for Scalable 3D Quantum Chiplets.

Jowesh Avisheik Goundar, La Thi Ngoc Mai, Moris Yuki, Otake Yugi, Hideo Kosaka, Fumihiro Inoue

Proceedings of the International 3D Systems Integration Conference, 2024

2019

Inspection Test of a Tunnel with an Inspection Vehicle for Tunnel Lining Concrete.

Satoru Nakamura, Atsushi Yamashita, Fumihiro Inoue, Daisuke Inoue, Yusuke Takahashi, Nobukazu Kamimura, Takao Ueno

J. Robotics Mechatronics, 2019

Shape Adaptation of the Inspection Guide Frame in Tunnels to Avoid Obstacles Detected by a Laser Range Finder.

Fumihiro Inoue, Soonsu Kwon, Satoru Nakamura, Yoshitaka Yanagihara

J. Robotics Mechatronics, 2019

Protective Layer for Collective Die to Wafer Hybrid Bonding.

Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.

A. Vandooren, Liesbeth Witters, Jacopo Franco, Arindam Mallik, Bertrand Parvais, Z. Wu, Amey Walke, V. Deshpande, E. Rosseel, Andriy Hikavyy, W. Li, L. Peng, Nouredine Rassoul, Geraldine Jamieson, Fumihiro Inoue, G. Verbinnen, Katia Devriendt, Lieve Teugels, N. Heylen, E. Vecchio, T. Zheng, Niamh Waldron, Vincent De Heyn, Dan Mocuta, Nadine Collaert

Proceedings of the 2018 International Conference on IC Design & Technology, 2018

2016

Extreme wafer thinning optimization for via-last applications.

Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Hybrid Station Aided Coexistence Scheme between Wireless PANs and Wireless LAN.

Fumihiro Inoue, Takayuki Nishio, Masahiro Morikura, Koji Yamamoto, Fusao Nuno, Takatoshi Sugiyama

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2015

2014

Virtual Continuous CWmin Control Scheme of WLAN.

Yuki Sangenya, Fumihiro Inoue, Masahiro Morikura, Koji Yamamoto, Fusao Nuno, Takatoshi Sugiyama

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2014

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Novel coexistence scheme between wireless sensor network and wireless LAN for HEMS.

Fumihiro Inoue, Masahiro Morikura, Takayuki Nishio, Koji Yamamoto, Fusao Nuno, Takatoshi Sugiyama

Proceedings of the IEEE Fourth International Conference on Smart Grid Communications, 2013

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.

S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Editorial: Construction Robot.

Yoshitaka Yanagihara, Hiroshi Yoshinada, Fumihiro Inoue

J. Robotics Mechatronics, 2012

A Study on Position Measurement System Using Laser Range Finder and its Application for Construction Work.

Fumihiro Inoue, Takeshi Sasaki, Xiangqi Huang, Hideki Hashimoto

J. Robotics Mechatronics, 2012

High Accuracy Position Marking System Applying Mobile Robot in Construction Site.

Fumihiro Inoue, Eri Ohmoto

J. Robotics Mechatronics, 2012

An Accurate and Efficient Pile Driver Positioning System Using Laser Range Finder.

Xiangqi Huang, Takeshi Sasaki, Hideki Hashimoto, Fumihiro Inoue, Bo Zheng, Takeshi Masuda, Katsushi Ikeuchi

Proceedings of the Advances in Depth Image Analysis and Applications, 2012

Circle Fitting Based Pile Positioning and Machine Pose Estimation from Range Data for Pile Driver Navigation.

Takeshi Sasaki, Hiroshi Kawahara, Fumihiro Inoue, Hideki Hashimoto

Proceedings of the 10th IFAC Symposium on Robot Control, SyRoCo 2012, Dubrovnik, Croatia, 2012

2011

Low temperature through-Si via fabrication using electroless deposition.

Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Circle fitting based position measurement system using laser range finder in construction fields.

Hajime Tamura, Takeshi Sasaki, Hideki Hashimoto, Fumihiro Inoue

Proceedings of the 2010 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2010

All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers.

Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

A Study on Adaptive Arch Structure Applying Variable Geometry Truss (Mechanism of Movable Arch Roof with External Panel).

Fumihiro Inoue

J. Robotics Mechatronics, 2009

2000

Development of Suspender Device Controlled by Gyroscopic Moments (Outline of Original Device and Its Improvement).

Fumihiro Inoue, Kouji Watanabe, Akira Wakabayashi, Yoshitsugu Nekomoto

J. Robotics Mechatronics, 2000

1998

A Study of Autonomous Mobile System in Outdoor Environment (Part 2: Sign Guided Autonomous Transportation System).

Jun-ichi Takiguchi, Kiyoshi Iwama, Hiroshi Sugie, Masanori Kato, Takayuki Kiyonaga, Takumi Hashizume, Fumihiro Inoue, Kyoji Yoshino, Yutaro Omote

Proceedings of the IEEE International Conference on Robotics and Automation, 1998