Fumiaki Yamada

According to our database, Fumiaki Yamada authored at least 9 papers between 2009 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

Robust control of active suspension to improve ride comfort with structural constraints.

Fumiaki Yamada, Kohei Suzuki, Tatsuo Toda, Gan Chen, Isao Takami

Proceedings of the IEEE 14th International Workshop on Advanced Motion Control, 2016

2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Thermo-mechanical evaluation of 3D packages.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.

Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

High density 3D integration by pre-applied Inter Chip Fill.

Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill.

Akihiro Horibe, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2009