Fumiaki Yamada
According to our database1,
Fumiaki Yamada
authored at least 9 papers
between 2009 and 2016.
Collaborative distances:
Collaborative distances:
Timeline
2009
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2011
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2016
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On csauthors.net:
Bibliography
2016
Robust control of active suspension to improve ride comfort with structural constraints.
Proceedings of the IEEE 14th International Workshop on Advanced Motion Control, 2016
2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2011
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill.
Proceedings of the IEEE International Conference on 3D System Integration, 2009