Frøydis Oldervoll

According to our database, Frøydis Oldervoll authored at least 2 papers between 2004 and 2008.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2008

High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization.

Rolf Johannessen, Frøydis Oldervoll, Frode Strisland

Microelectron. Reliab., 2008

2004

Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures.

Frøydis Oldervoll, Frode Strisland

Microelectron. Reliab., 2004