Frédéric Richardeau
Orcid: 0000-0002-6964-8054
According to our database1,
Frédéric Richardeau
authored at least 30 papers
between 2002 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
-
on orcid.org
On csauthors.net:
Bibliography
2024
A Full Transient ElectroThermal - Elastoplastic Mechanical and Metallurgical 2D FEM of SiC MOSFET for Gate-Region Stress Investigation under Short-Pulse Short-Circuit (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2024
2023
Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023
On the Electro-Thermal 2D FEM Parametric Analysis of SiC Vertical MOSFET Including Gate-Oxide Charge-Trapping Thermal Dependency: Application for Fast Transient Extreme Short-Circuit Operation.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023
2021
Comparison between ig integration and vgs derivation methods dedicated to fast short-circuit 2D diagnosis for wide bandgap power transistors.
Math. Comput. Simul., 2021
New Monolithic Multi-terminal Si-chips Integrating a Power Converter Phase-leg for Specific Applications.
Proceedings of the 2021 28th International Conference on Mixed Design of Integrated Circuits and System, 2021
2019
SiC power MOSFET in short-circuit operation: Electro-thermal macro-modelling combining physical and numerical approaches with circuit-type implementation.
Math. Comput. Simul., 2019
2018
Ensure an original and safe "fail-to-open" mode in planar and trench power SiC MOSFET devices in extreme short-circuit operation.
Microelectron. Reliab., 2018
A CMOS gate driver with ultra-fast dV/dt embedded control dedicated to optimum EMI and turn-on losses management for GaN power transistors.
Proceedings of the 14th Conference on Ph.D. Research in Microelectronics and Electronics, 2018
Monolithic Complementary Multi-terminal RC-IGBT Chips for Compact Multi-phase Power Converter.
Proceedings of the 25th International Conference "Mixed Design of Integrated Circuits and System", 2018
2017
Versatile Three-Level FC-NPC Converter With High Fault-Tolerance Capabilities: Switch Fault Detection and Isolation and Safe Postfault Operation.
IEEE Trans. Ind. Electron., 2017
Investigation on damaged planar-oxide of 1200 V SiC power MOSFETs in non-destructive short-circuit operation.
Microelectron. Reliab., 2017
Gate leakage-current analysis and modelling of planar and trench power SiC MOSFET devices in extreme short-circuit operation.
Microelectron. Reliab., 2017
Design and fault-operation analysis of a modular cyclic cascade inter-cell transformer (ICT) for parallel multicell converters.
Math. Comput. Simul., 2017
2015
Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection.
Microelectron. Reliab., 2015
2014
Post-fault reconfiguration for a versatile and hybrid 4 Leg NPC-flying capacitor topology.
Proceedings of the 23rd IEEE International Symposium on Industrial Electronics, 2014
2013
Evaluation of V<sub><i>ce</i></sub> Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling.
IEEE Trans. Ind. Electron., 2013
IEEE Trans. Ind. Electron., 2013
Real-Time Monitoring for a Five-Level Double-Boost Power Factor Controller Including Postfault Reconfiguration.
IEEE Trans. Ind. Electron., 2013
A single-chip integration approach of switching cells suitable for medium power applications.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013
Pre-design methodology and results of a robust monolithic Inter Cell Transformer (ICT) for parallel multicell converter.
Proceedings of the IECON 2013, 2013
2012
PCB dual-switch fuse with energetic materials embedded: Application for new fail-safe and fault-tolerant converters.
Microelectron. Reliab., 2012
2011
IEEE Trans. Ind. Electron., 2011
New Multilevel Converters Based on Stacked Commutation Cells With Shared Power Devices.
IEEE Trans. Ind. Electron., 2011
Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters.
Microelectron. Reliab., 2011
2010
2007
IEEE Trans. Ind. Electron., 2007
2006
IEEE Trans. Ind. Electron., 2006
2005
Using the multilevel imbricated cells topologies in the design of low-power power-factor-corrector converters.
IEEE Trans. Ind. Electron., 2005
2002