Frederic Monsieur

According to our database1, Frederic Monsieur authored at least 19 papers between 2001 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
A Versatile 55-nm SiGe BiCMOS Technology for Wired, Wireless, and Satcom Applications.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2024

2023
Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Insight Into HCI Reliability on I/O Nitrided Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

40-nm RFSOI technology exhibiting 90fs RON × COFF and fT/fMAX of 250 GHz/350 GHz targeting sub-6 GHz and mmW 5G applications.
Proceedings of the 53rd IEEE European Solid-State Device Research Conference, 2023

2017
Simulation of the thermal stress induced by CW 1340 nm laser on 28 nm advanced technologies.
Microelectron. Reliab., 2017

2016
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs.
Microelectron. Reliab., 2016

2014
The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2009
High voltage devices in advanced CMOS technologies.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2009

2008
Impact of inside spacer process on fully self-aligned 250 GHz SiGe: C HBTs reliability performances: a-Si vs. nitride.
Microelectron. Reliab., 2008

2007
Degradation mechanism understanding of NLDEMOS SOI in RF applications.
Microelectron. Reliab., 2007

2005
Multi-vibrational hydrogen release: Physical origin of T<sub>bd</sub>, Q<sub>bd</sub> power-law voltage dependence of oxide breakdown in ultra-thin gate oxides.
Microelectron. Reliab., 2005

2003
New insights into the change of voltage acceleration and temperature activation of oxide breakdown.
Microelectron. Reliab., 2003

On the role of holes in oxide breakdown mechanism in inverted nMOSFETs.
Microelectron. Reliab., 2003

2002
Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement.
Microelectron. Reliab., 2002

Gate oxide Reliability assessment optimization.
Microelectron. Reliab., 2002

2001
Determination of Dielectric Breakdown Weibull Distribution Parameters Confidence Bounds for Accurate Ultrathin Oxide Reliability Predictions.
Microelectron. Reliab., 2001

Wear-out, breakdown occurrence and failure detection in 18-25 Å ultrathin oxides.
Microelectron. Reliab., 2001

Low frequency noise and reliability properties pf 0.12 mum CMOS devices with Ta<sub>2</sub>O<sub>5</sub> as gate dielectrics.
Microelectron. Reliab., 2001

Failures in ultrathin oxides: Stored energy or carrier energy driven?
Microelectron. Reliab., 2001


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