Fengze Hou
According to our database1,
Fengze Hou
authored at least 3 papers
between 2016 and 2017.
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Bibliography
2017
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
2016
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.
Microelectron. Reliab., 2016