Fengwei Dai
According to our database1,
Fengwei Dai
authored at least 3 papers
between 2020 and 2022.
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Bibliography
2022
Research on Ni<sub>3</sub>Sn<sub>4</sub> intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.
IEICE Electron. Express, 2022
2021
Evaluation of Talent Cultivation Quality of Modern Apprenticeship Based on Context-Input-Process-Product Model.
Int. J. Emerg. Technol. Learn., 2021
2020
A Data Management Strategy for Property Management Information System Based on the Internet of Things.
Ingénierie des Systèmes d Inf., 2020