Fenglian Sun
According to our database1,
Fenglian Sun
authored at least 5 papers
between 2008 and 2018.
Collaborative distances:
Collaborative distances:
Timeline
2008
2010
2012
2014
2016
2018
0
1
2
3
1
1
2
1
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2018
A new hermetic sealing method for ceramic package using nanosilver sintering technology.
Microelectron. Reliab., 2018
2015
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.
Microelectron. Reliab., 2015
2014
Evaluating board level solder interconnects reliability using vibration test methods.
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
2008
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.
Microelectron. Reliab., 2008