Fengjuan Wang
Orcid: 0000-0002-9829-0565
According to our database1,
Fengjuan Wang
authored at least 48 papers
between 2007 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
Neurocomputing, 2025
2024
Microelectron. J., February, 2024
IEICE Electron. Express, 2024
Expert Syst. Appl., 2024
Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs.
Appl. Soft Comput., 2024
Proceedings of the 32nd ACM International Conference on Multimedia, MM 2024, Melbourne, VIC, Australia, 28 October 2024, 2024
2023
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.
Microelectron. J., 2023
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.
IEICE Electron. Express, 2023
2022
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.
IEEE Trans. Very Large Scale Integr. Syst., 2022
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.
Microelectron. J., 2022
Microelectron. J., 2022
IEICE Electron. Express, 2022
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.
IEICE Electron. Express, 2022
IEICE Electron. Express, 2022
2021
Microelectron. J., 2021
Integr., 2021
IEICE Electron. Express, 2021
IEICE Electron. Express, 2021
A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR.
Ad Hoc Networks, 2021
Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex.
Ad Hoc Networks, 2021
2019
Sensors, 2019
IEICE Electron. Express, 2019
A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image.
EURASIP J. Wirel. Commun. Netw., 2019
IEEE Access, 2019
Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection.
Proceedings of the Communications, Signal Processing, and Systems, 2019
Proceedings of the Communications, Signal Processing, and Systems, 2019
2018
Commun. Nonlinear Sci. Numer. Simul., 2018
Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends.
Proceedings of the AMIA 2018, 2018
2017
IEEE Trans. Very Large Scale Integr. Syst., 2017
IEICE Electron. Express, 2017
Proceedings of the AMIA 2017, 2017
2016
IEICE Electron. Express, 2016
Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).
IEICE Electron. Express, 2016
2015
J. Comput. Methods Sci. Eng., 2015
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.
IEICE Electron. Express, 2015
Study on thermal stress and keep-out zone induced by Cu and SiO<sub>2</sub> filled coaxial-annular through-silicon via.
IEICE Electron. Express, 2015
Proceedings of the Bio-Inspired Computing - Theories and Applications, 2015
2014
Microelectron. J., 2014
2013
Thermo-mechanical performance of Cu and SiO<sub>2</sub> filled coaxial through-silicon-via (TSV).
IEICE Electron. Express, 2013
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).
IEICE Electron. Express, 2013
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.
IEICE Electron. Express, 2013
2011
Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock.
Proceedings of the ICEIS 2011, 2011
A thermal model for the top layer of 3D integrated circuits considering through silicon vias.
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011
2007
Proceedings of the IAPR Conference on Machine Vision Applications (IAPR MVA 2007), 2007