Fengjuan Wang

Orcid: 0000-0002-9829-0565

According to our database¹, Fengjuan Wang authored at least 48 papers between 2007 and 2025.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

Dataset

Other

Links

On csauthors.net:

Bibliography

2025

VCF: An effective Vision-Centric Framework for Visual Question Answering.

[BibT_eX]

[DOI]

Neurocomputing, 2025

2024

A compact fifth-order SIW BPF based on TSV technology with high selectivity.

[BibT_eX]

[DOI]

Microelectron. J., February, 2024

Effect of annealing residual stress on mobility of TSV vertical switch.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2024

EPK-CLIP: External and Priori Knowledge CLIP for action recognition.

[BibT_eX]

[DOI]

Expert Syst. Appl., 2024

Credit risk prediction based on an interpretable three-way decision method: Evidence from Chinese SMEs.

[BibT_eX]

[DOI]

Meng Pang

Fengjuan Wang

Zhe Li

Appl. Soft Comput., 2024

Synergetic Prototype Learning Network for Unbiased Scene Graph Generation.

[BibT_eX]

[DOI]

Proceedings of the 32nd ACM International Conference on Multimedia, MM 2024, Melbourne, VIC, Australia, 28 October 2024, 2024

2023

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.

[BibT_eX]

[DOI]

Microelectron. J., 2023

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2023

2022

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2022

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.

[BibT_eX]

[DOI]

Xiangkun Yin

Jingyu Lu

Fengjuan Wang

Microelectron. J., 2022

Compact high-performance dual-frequency power divider based on TSV.

[BibT_eX]

[DOI]

Microelectron. J., 2022

Wideband transmission optimization for heterogenous interconnection in 3D IC.

[BibT_eX]

[DOI]

Xiangkun Yin

Jingyu Lu

Fengjuan Wang

IEICE Electron. Express, 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

TSV-based SIW bandpass filter for W-band mobile communication applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

[BibT_eX]

[DOI]

Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.

[BibT_eX]

[DOI]

Integr., 2021

Analytical models of AC inductance and quality factor for TSV-based inductor.

[BibT_eX]

[DOI]

Xiangkun Yin

Fengjuan Wang

IEICE Electron. Express, 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR.

[BibT_eX]

[DOI]

Ad Hoc Networks, 2021

Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex.

[BibT_eX]

[DOI]

Ad Hoc Networks, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.

[BibT_eX]

[DOI]

IEEE Access, 2021

2019

Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response.

[BibT_eX]

[DOI]

Sensors, 2019

Investigation on impact of substrate on low-pass filter based on coaxial TSV.

[BibT_eX]

[DOI]

Fengjuan Wang

He Li

Ningmei Yu

IEICE Electron. Express, 2019

A high-pass filter based on through-silicon via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Jia Huang

Ningmei Yu

IEICE Electron. Express, 2019

A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image.

[BibT_eX]

[DOI]

EURASIP J. Wirel. Commun. Netw., 2019

Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning.

[BibT_eX]

[DOI]

IEEE Access, 2019

Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection.

[BibT_eX]

[DOI]

Proceedings of the Communications, Signal Processing, and Systems, 2019

A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator.

[BibT_eX]

[DOI]

Proceedings of the Communications, Signal Processing, and Systems, 2019

2018

A novel guard method of through-silicon-via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Jia Huang

Ningmei Yu

IEICE Electron. Express, 2018

Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model.

[BibT_eX]

[DOI]

Fengjuan Wang

Hongjun Cao

Commun. Nonlinear Sci. Numer. Simul., 2018

Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends.

[BibT_eX]

[DOI]

Andrew Placona

Fengjuan Wang

Rich King

Proceedings of the AMIA 2018, 2018

2017

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias.

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEEE Trans. Very Large Scale Integr. Syst., 2017

Equivalent circuit model of through-silicon-via in slow wave mode.

[BibT_eX]

[DOI]

Fengjuan Wang

Gang Wang

Ningmei Yu

IEICE Electron. Express, 2017

Data Munging Tricks Can Build Better High Risk Maternity Predictive Models.

[BibT_eX]

[DOI]

Proceedings of the AMIA 2017, 2017

2016

Explicit model of thermal stress induced by annular through-silicon-via (TSV).

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2016

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2016

2015

Based on reverse molding technology of the impeller of the fluid dynamics analysis.

[BibT_eX]

[DOI]

J. Comput. Methods Sci. Eng., 2015

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2015

Study on thermal stress and keep-out zone induced by Cu and SiO<sub>2</sub> filled coaxial-annular through-silicon via.

[BibT_eX]

[DOI]

Fengjuan Wang

Ningmei Yu

IEICE Electron. Express, 2015

Parallel Implementation of P Systems for Data Clustering on GPU.

[BibT_eX]

[DOI]

Proceedings of the Bio-Inspired Computing - Theories and Applications, 2015

2014

Capacitance characterization of tapered through-silicon-via considering MOS effect.

[BibT_eX]

[DOI]

Microelectron. J., 2014

2013

Effect of Inertia Weight w on PSO-SA Algorithm.

[BibT_eX]

[DOI]

Shigang Wang

Fangfang Zhou

Fengjuan Wang

Int. J. Online Biomed. Eng., 2013

Thermo-mechanical performance of Cu and SiO<sub>2</sub> filled coaxial through-silicon-via (TSV).

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

2011

Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock.

[BibT_eX]

Fengjuan Wang

Zhihua Xie

Proceedings of the ICEIS 2011, 2011

A thermal model for the top layer of 3D integrated circuits considering through silicon vias.

[BibT_eX]

[DOI]

Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011

2007

A Facial Sketch Animation Generator for Mobile Communication.

[BibT_eX]

[DOI]

Proceedings of the IAPR Conference on Machine Vision Applications (IAPR MVA 2007), 2007

Fengjuan Wang

Timeline

Legend:

Links

On csauthors.net:

Bibliography

Loading...