Feng-Hsiang Lo
According to our database1,
Feng-Hsiang Lo
authored at least 4 papers
between 2006 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
2010
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2010), May 30, 2010
2006
Proceedings of the 2006 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2006), 2006
Proceedings of the Global Telecommunications Conference, 2006. GLOBECOM '06, San Francisco, CA, USA, 27 November, 2006