Fei Chong Ng
According to our database1,
Fei Chong Ng
authored at least 3 papers
between 2016 and 2018.
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Bibliography
2018
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab., 2018
2017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab., 2017
2016
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab., 2016