Fei Chong Ng

According to our database1, Fei Chong Ng authored at least 3 papers between 2016 and 2018.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2018
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab., 2018

2017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab., 2017

2016
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab., 2016


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