F. X. Che

According to our database, F. X. Che authored at least 6 papers between 2006 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Study on reliability of PQFP assembly with lead free solder joints under random vibration test.

F. X. Che, John H. L. Pang

Microelectron. Reliab., 2015

2012

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods.

Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

Microelectron. Reliab., 2012

2011

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Vibration reliability test and finite element analysis for flip chip solder joints.

F. X. Che, John H. L. Pang

Microelectron. Reliab., 2009

2006

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards.

Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong

Microelectron. Reliab., 2006

Drop impact reliability testing for lead-free and lead-based soldered IC packages.

Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low

Microelectron. Reliab., 2006