F. Patrick McCluskey

According to our database, F. Patrick McCluskey authored at least 8 papers between 2006 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications.

Shuji Nishimoto, Seyed Ali Moeini, Toyo Ohashi, Yoshiyuki Nagatomo, F. Patrick McCluskey

Microelectron. Reliab., 2018

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment.

Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht

Microelectron. Reliab., 2018

Mechanism of wire bond shear testing.

Subramani Manoharan, Chandradip Patel, Stevan Hunter, F. Patrick McCluskey

Microelectron. Reliab., 2018

Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs).

Nga Man Li, Subramani Manoharan, Diganta Das, F. Patrick McCluskey

Microelectron. Reliab., 2018

2014

Physics-of-failure assessment methodology for power electronic systems.

David Squiller, Hannes Greve, Elena Mengotti, F. Patrick McCluskey

Microelectron. Reliab., 2014

Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications.

Pedro Quintero, F. Patrick McCluskey, B. Koene

Microelectron. Reliab., 2014

Eliminating infant mortality in metallized film capacitors by defect detection.

F. Patrick McCluskey, N. M. Li, Elena Mengotti

Microelectron. Reliab., 2014

2006

Reliability of high temperature solder alternatives.

F. Patrick McCluskey, M. Dash, Z. Wang, D. Huff

Microelectron. Reliab., 2006