F. Ling

According to our database, F. Ling authored at least 1 paper in 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.

Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2010