Eva Leong-Ching Wai

According to our database, Eva Leong-Ching Wai authored at least 6 papers between 2009 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Ultrasonic Wavefront Computing Architecture on CMOS for Fourier Transform Computation.

Y. S. Wang, K. T. C. Chai, Daniel S. H. Chen, Eva Leong-Ching Wai, J. Sharma, B. V. Phuong, Ching Eng Png, Amit Lal

Proceedings of the 8th International Conference on Frontiers of Signal Processing, 2023

2019

Low-Cost, Tiny-Sized MEMS Hydrophone Sensor for Water Pipeline Leak Detection.

Jinghui Xu, Kevin Tshun-Chuan Chai, Guoqiang Wu, Beibei Han, Eva Leong-Ching Wai, Wei Li, Jason Yeo, Edwin Nijhof, Yuandong Gu

IEEE Trans. Ind. Electron., 2019

Development of Six-Degree-of-Freedom Inertial Sensors With an 8-in Advanced MEMS Fabrication Platform.

Guoqiang Wu, Beibei Han, Daw Don Cheam, Leong Ching Wai, Peter Hyun Kee Chang, Navab Singh, Yuandong Gu

IEEE Trans. Ind. Electron., 2019

2012

Modular sensor chip design for package stress evaluation and reliability characterisation.

A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai

Microelectron. Reliab., 2012

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2009

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen

Microelectron. Reliab., 2009