Eungchul Kim

According to our database, Eungchul Kim authored at least 2 papers between 2019 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale.

Eungchul Kim, Seungjun Oh, Taesung Kim

Proceedings of the IEEE International Workshop on Metrology for Industry 4.0 & IoT, 2021

2019

In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing.

Eungchul Kim, Gunhoo Woo, Taesung Kim

Proceedings of the 2nd Workshop on Metrology for Industry 4.0 and IoT MetroInd4.0&IoT 2019, 2019