Ertugrul Demircan

According to our database, Ertugrul Demircan authored at least 6 papers between 2001 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis.

Shaoyi Peng, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

Integr., 2020

2018

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.

Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2018

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

2016

Voltage-based electromigration immortality check for general multi-branch interconnects.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

2006

Effects of Interconnect Process Variations on Signal Integrity.

Ertugrul Demircan

Proceedings of the 2006 IEEE International SOC Conference, Austin, Texas, USA, 2006

2001

Reticle Enhancement Technology: Implications and Challenges for Physical Design.

Warren Grobman, Matt Thompson, Ruoping Wang, Chi-Min Yuan, Ruiqi Tian, Ertugrul Demircan

Proceedings of the 38th Design Automation Conference, 2001