Erping Li
Orcid: 0000-0002-5006-7399Affiliations:
- Zhejiang University, College of Information Science and Electronics Engineering, Haining, China
- Zhejiang Provincial Key Laboratory of Advanced Microelectronic Intelligent Systems and Applications, Hangzhou, China
According to our database1,
Erping Li
authored at least 30 papers
between 2019 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Breaking the Degrees-of-Freedom Limit of Holographic MIMO Communications: A 3-D Antenna Array Topology.
IEEE Trans. Veh. Technol., August, 2024
Active-Learning-Based Sparse Near-Field Scanning With Time-Domain Current Measurement for Conductive Coupling Path Visualization.
IEEE Trans. Instrum. Meas., 2024
2023
A new pre-conditioned STDP rule and its hardware implementation in neuromorphic crossbar array.
Neurocomputing, November, 2023
Multi-Agent Reinforcement Learning-Based Decentralized Spectrum Access in Vehicular Networks With Emergent Communication.
IEEE Commun. Lett., January, 2023
Modeling and Analysis of Spike Signal Sequence for Memristor Crossbar Array in Neuromorphic Chips.
IEEE Trans. Circuits Syst. I Regul. Pap., 2023
CoRR, 2023
Breaking the Degrees-of-Freedom Limit of Holographic MIMO Communications: A 3-D Array Topology.
CoRR, 2023
Proceedings of the 5th International Conference on Robotics, 2023
2022
Modeling and Signal Integrity Analysis of RRAM-Based Neuromorphic Chip Crossbar Array Using Partial Equivalent Element Circuit (PEEC) Method.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
STSC-SNN: Spatio-Temporal Synaptic Connection with Temporal Convolution and Attention for Spiking Neural Networks.
CoRR, 2022
MAP-SNN: Mapping Spike Activities with Multiplicity, Adaptability, and Plasticity into Bio-Plausible Spiking Neural Networks.
CoRR, 2022
SUTD-PRCM Dataset and Neural Architecture Search Approach for Complex Metasurface Design.
CoRR, 2022
IEEE Access, 2022
Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity.
IEEE Access, 2022
Proceedings of the 22nd IEEE International Conference on Communication Technology, 2022
2021
Circuit Modeling for RRAM-Based Neuromorphic Chip Crossbar Array With and Without Write-Verify Scheme.
IEEE Trans. Circuits Syst. I Regul. Pap., 2021
A Novel Miniaturized Ultra-Wideband Frequency Selective Surface With Rapid Band Edge.
IEEE Access, 2021
IEEE Access, 2021
2020
Miniaturized Polarization Insensitive Metamaterial Absorber Applied on EMI Suppression.
IEEE Access, 2020
IEEE Access, 2020
Support Vector Regression-Based Active Subspace (SVR-AS) Modeling of High-Speed Links for Fast and Accurate Sensitivity Analysis.
IEEE Access, 2020
Neutralization Line Decoupling Tri-Band Multiple-Input Multiple-Output Antenna Design.
IEEE Access, 2020
Diffusion Barrier Prediction of Graphene and Boron Nitride for Copper Interconnects by Deep Learning.
IEEE Access, 2020
2019
Wide-Band Modeling On-Chip Spiral Inductors Using Frequency-Dependent Conformal ADI-FDTD Method.
IEEE Access, 2019
Equilateral Triangular Dielectric Resonator and Metal Patch Hybrid Antenna for UWB Application.
IEEE Access, 2019
IEEE Access, 2019
Electron Transport in Graphene-Versus Al/Pd-Coated Thin Cu Films With Low-Surface Roughness: A First Principles Study.
IEEE Access, 2019
Analysis of Time Division Duplexing Noise Interference on Sounding Devices in Wireless Smartphones.
Proceedings of the Computing, Communications and IoT Applications, ComComAp 2019, Shenzhen, 2019