Erping Deng
Orcid: 0000-0001-5047-0834
According to our database1,
Erping Deng
authored at least 4 papers
between 2017 and 2021.
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Bibliography
2021
IEEE Trans. Instrum. Meas., 2021
2017
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs.
Microelectron. Reliab., 2017