Erik Vick

According to our database, Erik Vick authored at least 3 papers between 2010 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test.

Dorota S. Temple, Dean Malta, Erik P. Vick, Matthew R. Lueck, Scott H. Goodwin, Mark S. Muzilla, Christopher M. Masterjohn, Mark R. Skokan

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2011

Vias-last process technology for thick 2.5D Si interposers.

Erik Vick, Scott H. Goodwin, Garry Cunnigham, Dorota Temple

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Fabrication of TSV-based silicon interposers.

Dean Malta, Erik Vick, Scott H. Goodwin, Christopher Gregory, Matthew Lueck, Alan Huffman, Dorota Temple

Proceedings of the IEEE International Conference on 3D System Integration, 2010