Eric Teck Heng Lim

According to our database, Eric Teck Heng Lim authored at least 5 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

2.31-Gb/s/ch Area-Efficient Crosstalk Canceled Hybrid Capacitive Coupling Interconnect for 3-D Integration.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE Trans. Very Large Scale Integr. Syst., 2016

2014

A 3-Gb/s/ch Simultaneous Bidirectional Capacitive Coupling Transceiver for 3DICs.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE Trans. Circuits Syst. II Express Briefs, 2014

2013

Design of self-biased fully differential receiver and crosstalk cancellation for capacitive coupled vertical interconnects in 3DICs.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

2012

Design of Simultaneous Bi-Directional Transceivers Utilizing Capacitive Coupling for 3DICs in Face-to-Face Configuration.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

2011

Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC.

Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011