Eric Pek

According to our database, Eric Pek authored at least 2 papers between 2004 and 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Dynamic responses and solder joint reliability under board level drop test.

Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong

Microelectron. Reliab., 2007

2004

Impact life prediction modeling of TFBGA packages under board level drop test.

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Microelectron. Reliab., 2004