Enamul Kabir
According to our database1,
Enamul Kabir
authored at least 3 papers
between 2015 and 2022.
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Bibliography
2022
A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
2020
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
2015
Coupled accelerated stress tests for comprehensive field reliability - Synergistic effects of moisture and temperature cycling.
Proceedings of the IEEE International Reliability Physics Symposium, 2015