Emilie Deloffre

According to our database, Emilie Deloffre authored at least 3 papers between 2005 and 2011.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2011

Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.

Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Use of optical metrology for wafer level packaging of CMOS image sensor.

D. Le Cunff, A. Pravdivtsev, K. Le Chao, C. Euvrard, Emilie Deloffre, A. Cailean

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2005

Electrical properties in low temperature range (5K-300K) of Tantalum Oxide dielectric MIM capacitors.

Emilie Deloffre, L. Montès, Gérard Ghibaudo, Sylvie Bruyère, Serge Blonkowski, Stéphane Bécu, Mickael Gros-Jean, Sébastien Crémer

Microelectron. Reliab., 2005